The data center chillers market is projected to exceed USD 6.4 billion by the year 2035.
Thermal Management Shift
emerging tech
deals
sentiment shift
Driven by soaring chip power densities, evidenced by Microsoft's microfluidics and major vendor pivots, facility cooling is transitioning from macro to integrated solutions. This requires professionals across hyperscale and enterprise sites to urgently re-evaluate power distribution, plumbing, and the entire thermal loop supporting dense compute.
This article provides a practical guide to implementing rack-level cooling solutions for high-performance GPU environments, focusing on retrofitting for increased density.
Accelsius is developing a two-phase cooling future, with new funding supporting product development, a 300 MW customer project, and research into coolant fluids.
Advanced cooling technologies are significantly influencing and reshaping the design decisions being made for data centers.
During a DCD>Talks session, Vertiv's Maurizio Frizziero discussed how increasing chip temperatures affect global cooling infrastructure and identified three key pillars for advancing the AI transformation.
Barocal has raised $10 million to advance its solid-state cooling system for data centers, which could provide an efficient alternative to traditional air cooling methods.
Data Centre World London 2026 will explore critical questions for artificial intelligence-driven operators regarding their partnerships with infrastructure providers.
The Data Center World 2026 Expo highlighted advancements in liquid cooling technologies, showcasing the latest equipment designed for cooling artificial intelligence infrastructure.
The article discusses the adoption of liquid cooling technologies, specifically direct-to-chip architecture, for AI data centers to enhance cooling efficiency, reduce resource dependency, and support next-generation infrastructure with higher rack densities.
As artificial intelligence workloads intensify, cooling systems are transitioning from a design element to a critical deployment challenge, requiring operators to adapt to significantly increased power densities.
To address the extreme power densities driven by artificial intelligence, data center operators are increasingly adopting hybrid cooling solutions, modular construction methods, and tightly integrated systems to maintain optimal performance, efficiency, and reliability.
Experts at Data Center World are discussing how the increasing demands of generative and agentic artificial intelligence are compelling a reassessment of power, cooling, and overall infrastructure strategies for data centers.
Michel Chartier of WSP discusses the evolution of engineering teams in the data center industry, emphasizing the need for specialized training to handle advanced cooling systems and emerging 800V DC infrastructure driven by artificial intelligence workloads.
The article discusses the adoption of liquid cooling for high-density computing needs, particularly in the context of AI workloads, while noting a slower uptake by traditional enterprise IT departments.
Precision liquid cooling and industrial resiliency are crucial for scaling artificial intelligence infrastructure, driving data center performance through enhanced resilience and speed.
Brian Lillie of ZutaCore discussed the challenges of rising heat and power demands driven by artificial intelligence and explained how their waterless two-phase liquid cooling technology supports next-generation, high-density data center deployments.
While microfluidic cooling shows promise for future data centers, its widespread adoption faces significant hurdles related to manufacturing complexity and ongoing maintenance requirements.
The increasing demand for artificial intelligence data centers is leading to significant backlash over water consumption, prompting exploration into technologies like atmospheric water harvesting to generate sustainable cooling water from the air.
Akash Systems, in collaboration with AMD and Nvidia, is pioneering diamond-based cooling solutions to address the thermal challenges hindering the scalability of artificial intelligence in data centers.
Vertiv is enhancing its thermal management offerings for AI infrastructure through the acquisition of ThermoKey, aiming to address critical cooling bottlenecks and strengthen its position in the AI hardware market.
Artificial intelligence workloads have significant implications for the design of high-density data centers.
Waterless cooling technology is emerging as an essential component for building scalable infrastructure to support artificial intelligence factories.
The data center HVAC market is projected to exceed USD 36 billion by 2035, indicating significant growth in cooling infrastructure.
Jason Hoffman of Switch DataCenters discusses the impact of artificial intelligence on data center operations, including exascale facilities, high-density systems, and integrating power and cooling infrastructure for optimal performance with Kat Sullivan during DCD>Talks.
The strategy of 'icebanking' is being explored as a method to mitigate increasing energy expenses within digital infrastructure operations.
Executives from Flex detailed their new integrated, factory-built platform—incorporating liquid cooling, higher-voltage DC power, and global manufacturing—designed to significantly reduce deployment timelines for AI-scale infrastructure.
→
Eaton's $9.5 billion strategic pivot toward thermal solutions is analyzed as a key indicator potentially signaling the next trillion-dollar phase of power, cooling, and deployment strategy across the US artificial intelligence data center market.
Vertiv's recent $1 billion strategic acquisition is an aggressive attempt to establish dominance over the critical reliability layer that now ultimately governs the performance outcomes of artificial intelligence cooling solutions.
Microsoft introduced an in-chip microfluidic cooling system that uses etched pathways within the silicon to remove heat up to three times more effectively than standard cold plates, promising denser and more cost-efficient AI hardware.